Electronics

Demand Background With the rapid development of the electronic information industry, electronic devices are gradually evolving towards portability and high integration, which increasesthechallenges for heat managementbecause the internal heat flux density and heat flow within these devices are increasing. For example, workstations, which undergo continuous and high-intensity workloads, require high-level chipsets and high-performance multi-core processors, demanding superior machine stability.Thus, the arrangement of heat sources and heat dissipation design inside the chassis becomes crucialbecause temperature greatly affects the performance of electronic components. Solution Simulation-assisted thermal design is the most effective approach to address heat management for electronic devices. IBE has developed an Simdroid Electronic Cooling module for heat dissipation in electronic components and devices. This module features a professional component model library for electronic products, which enables users to create geometric models using a “building-block” approach rapidly. Additionally, it facilitates the automatic generation of high-quality orthogonal hexahedral meshes, supports fluid-thermal coupling, and delivers highly accurate simulation results. The simulation of“HP Z8 G4” workstationhas been done with the Simdroid Electronic Cooling moduleto analyze the internal heat dissipation conditions during operations. Geometric Modeling: The internal chassis model is simplified to save computational resources. Only critical heat sources and components that substantially impact heat …